Breaking News Bar

Business News and Information

Worldwide Advanced Packaging Industry to 2027 - by Technology, End-user, Application, Product & Geography

DUBLIN, Aug. 11, 2020 /PRNewswire/ -- The "Advanced Packaging - Global Market Outlook (2019-2027)" report has been added to ResearchAndMarkets.com's offering.

Research and Markets Logo

The Global Advanced Packaging market accounted for $29.42 billion in 2019 and is expected to reach $73.36 billion by 2027 growing at a CAGR of 12.1% during the forecast period. Some of the key factors propelling market growth include exponential adoptions of IoT by various industry verticals, rising demand for smart as well as power-efficient devices by the consumers, increasing trend of advanced architecture in electronic products, and favourable government policies and regulations in developing countries.

However, high initial costs of advanced packaging with higher maintenance costs of these systems are likely to hamper the market. Moreover, the rise in the usage of advanced packaging by the automotive industry is creating further large opportunities for the players operating in the advanced packaging market.

Advanced packaging is a supporting case that prevents physical damage and corrosion to silicon wafers, logic units, and memory, during the final stage of semiconductor manufacturing process. This packaging allows the chip to be connected to a circuit board. In addition, it involves grouping of a variety of distinct techniques, which include 2.5D, 3D-IC, fan-out-wafer-level packaging, and system-in-package.

By technology, Fan-out wafer level packaging (FOWLP) has emerged as a promising technology to meet the ever increasing demands of the consumer electronic products. The main advantages of FOWLP are the substrate-less package, lower thermal resistance, a higher performance due to shorter interconnects together with direct IC connection by thin film metallization instead of wire bonds or flip chip bumps and lower parasitic effects.

On the basis of geography, Asia Pacific region is expected to have considerable market growth during the forecast timeline, owing to huge end-user demand for advanced packaging in the countries like China and India and growing population and the customer-side demand. Prominent semiconductor manufacturing companies present in the region are fueling the demand for advanced semiconductor packaging. Moreover, China is the largest growing economy with a large population and according to statistics from China's semiconductor association, the import of IC is increasing for the consecutive year.

Some of the key players in advanced packaging market include ASE Technology Holding Co., Ltd., Qualcomm Technologies Inc., Taiwan Semiconductor Manufacturing Company, Renesas Electronics Corporation, Texas Instruments, Amkor Technology, Inc., Intel Corporation, Semiconductor Manufacturing International Corporation, STATS ChipPAC Ltd, SSS MicroTec SE, International Business Machines Corporation, Microchip Technology, United Microelectronics Corporation, Samsung Electronics Co. Ltd, Chipbond Technology Corporation, and Advanced Semiconductor Engineering Inc.

What the report offers:

  • Market share assessments for the regional and country-level segments
  • Strategic recommendations for the new entrants
  • Covers Market data for the years 2018, 2019, 2020, 2024 and 2027
  • Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
  • Strategic analysis: Drivers and Constraints, Product/Technology Analysis, Porter's five forces analysis, SWOT analysis, etc.
  • Strategic recommendations in key business segments based on the market estimations
  • Competitive landscaping mapping the key common trends
  • Company Profiling with detailed strategies, financials, and recent developments
  • Supply chain trends mapping the latest technological advancements

Key Topics Covered:

1 Executive Summary

2 Preface
2.1 Abstract
2.2 Stake Holders
2.3 Research Scope
2.4 Research Methodology
2.4.1 Data Mining
2.4.2 Data Analysis
2.4.3 Data Validation
2.4.4 Research Approach
2.5 Research Sources
2.5.1 Primary Research Sources
2.5.2 Secondary Research Sources
2.5.3 Assumptions

3 Market Trend Analysis
3.1 Introduction
3.2 Drivers
3.3 Restraints
3.4 Opportunities
3.5 Threats
3.6 Technology Analysis
3.7 End User Analysis
3.8 Application Analysis
3.9 Product Analysis
3.10 Emerging Markets
3.11 Impact of Covid-19

4 Porters Five Force Analysis
4.1 Bargaining power of suppliers
4.2 Bargaining power of buyers
4.3 Threat of substitutes
4.4 Threat of new entrants
4.5 Competitive rivalry

5 Global Advanced Packaging Market, By Technology
5.1 Introduction
5.2 Wafer Level CSP
5.3 Flip Chip CSP
5.4 Fan Out wafer-level packaging (FO WLP)
5.5 Flip-Chip Ball Grid Array
5.6 2.5D/3D
5.7 Chip-Scale Packaging
5.8 3D Integrated Circuit Packaging
5.9 Fan Out Silicon in Package
5.10 3D Wafer Level Package
5.11 Fan-in wafer-level packaging (FI WLP)
5.12 5D
5.13 3.0 DIC
5.14 Other Types
5.14.1 Flip-Chip Package-in-Package
5.14.2 Embedded Die
5.14.3 Thin Quad Flat Packages

6 Global Advanced Packaging Market, By End User
6.1 Introduction
6.2 Healthcare
6.3 Aerospace & Defense
6.4 Consumer Electronics
6.5 Automotive
6.6 Industrial
6.7 IT and Telecommunication
6.8 Other End Users
6.8.1 Paper & Pulp
6.8.2 Oil & Gas

7 Global Advanced Packaging Market, By Application
7.1 Introduction
7.2 MEMS & Sensor
7.3 Misc Logic and Memory
7.4 Analog & Mixed Signal
7.5 Wireless Connectivity
7.6 Optoelectronic
7.7 Light-emitting Diode (LED)

8 Global Advanced Packaging Market, By Product
8.1 Introduction
8.2 Intelligent Technology
8.3 Modified Atmosphere
8.4 Active Technology

9 Global Advanced Packaging Market, By Geography
9.1 Introduction
9.2 North America
9.2.1 US
9.2.2 Canada
9.2.3 Mexico
9.3 Europe
9.3.1 Germany
9.3.2 UK
9.3.3 Italy
9.3.4 France
9.3.5 Spain
9.3.6 Rest of Europe
9.4 Asia Pacific
9.4.1 Japan
9.4.2 China
9.4.3 India
9.4.4 Australia
9.4.5 New Zealand
9.4.6 South Korea
9.4.7 Rest of Asia Pacific
9.5 South America
9.5.1 Argentina
9.5.2 Brazil
9.5.3 Chile
9.5.4 Rest of South America
9.6 Middle East & Africa
9.6.1 Saudi Arabia
9.6.2 UAE
9.6.3 Qatar
9.6.4 South Africa
9.6.5 Rest of Middle East & Africa

10 Key Developments
10.1 Agreements, Partnerships, Collaborations and Joint Ventures
10.2 Acquisitions & Mergers
10.3 New Product Launch
10.4 Expansions
10.5 Other Key Strategies

11 Company Profiling
11.1 ASE Technology Holding Co., Ltd.
11.2 Qualcomm Technologies Inc.
11.3 Taiwan Semiconductor Manufacturing Company
11.4 Renesas Electronics Corporation
11.5 Texas Instruments
11.6 Amkor Technology, Inc.
11.7 Intel Corporation
11.8 Semiconductor Manufacturing International Corporation,
11.9 STATS ChipPAC Ltd
11.10 SSS MicroTec SE
11.11 International Business Machines Corporation
11.12 Microchip Technology
11.13 United Microelectronics Corporation
11.14 Samsung Electronics Co. Ltd
11.15 Chipbond Technology Corporation
11.16 Advanced Semiconductor Engineering Inc.

For more information about this report visit https://www.researchandmarkets.com/r/tsf17v

Research and Markets also offers Custom Research services providing focused, comprehensive and tailored research.

Media Contact:

Research and Markets
Laura Wood, Senior Manager
press@researchandmarkets.com

For E.S.T Office Hours Call +1-917-300-0470
For U.S./CAN Toll Free Call +1-800-526-8630
For GMT Office Hours Call +353-1-416-8900

U.S. Fax: 646-607-1907
Fax (outside U.S.): +353-1-481-1716

Cision View original content:http://www.prnewswire.com/news-releases/worldwide-advanced-packaging-industry-to-2027---by-technology-end-user-application-product--geography-301110061.html

SOURCE Research and Markets

Data & News supplied by www.cloudquote.io
Stock quotes supplied by Barchart
Quotes delayed at least 20 minutes.
By accessing this page, you agree to the following
Privacy Policy and Terms and Conditions.
 
bottom clear