Agenda for annual event on additive manufacturing includes technical presentations, networking, equipment demos and facility tours.
(PRUnderground) June 26th, 2019
The complete agenda has been announced for the Additive Manufacturing Conference + Expo (AMC) 2019, August 27-29 in Austin, TX. The three-day event will offer attendees unique ways to connect with leading suppliers, end-users and researchers of industrial applications for additive manufacturing technologies. The interactive event includes demonstrations, technical tours, networking and presentations all held against the backdrop of one of the nation’s most tech forward cities.
“Expanding the show for Austin allows us to dig deeper into all aspects of 3D printing technology for production,” said Dave Necessary, event manager. “Attendees will get to see equipment on the show floor, hear presentations on the latest in industrial 3D printing technology, visit two top notch facilities and experience everything Austin has to offer.”
The AMC conference program includes technical sessions examining design, materials, machinery and applications technology used in additive manufacturing for production. Specific topics include automation, aerospace, generative design, post-processing, metrology, machine learning, injection molds and more.
Technical presenters include OEMs, additive manufacturing service bureaus and machinery suppliers, such as GE Additive, EOS, Formally, ZEISS and more. Visitors will also be able to see the technologies in action with tours of EOS North America’s headquarters and the Essentium metal and polymer AM labs.
About Additive Manufacturing
About Additive Manufacturing Conference: Presented by Gardner Business Media’s Modern Machine Shop and Additive Manufacturing Magazine, the Additive Manufacturing Conference is a technical conference, exhibit hall and business networking event focused on the industrial applications of additive technologies for making functional components and end-use production parts.Press Contact
Original Press Release.